发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device by which a high terminal breakdown voltage is obtained. SOLUTION: The semiconductor device includes a second first-conductive type semiconductor layer, a third second-conductive type semiconductor layer, a field insulating film provided on the second first-conductive type semiconductor layer and the third second-conductive type semiconductor layer at a terminal region, a field plate electrode which is provided on the field insulating film, and connected to a second main electrode or a control electrode, and a floating field plate electrode with a floating potential. The second first-conductive type semiconductor layer is provided on a main surface of a first first-conductive type semiconductor layer at an element region and the terminal region outside the element region. The third second-conductive type semiconductor layer forms a periodic arrangement structure together with the second first-conductive type semiconductor layer in a lateral direction which is almost parallel to the main face of the first first-conductive type semiconductor layer. The floating field plate electrode is provided on the field insulating film positioned outside rather than the field plate electrode, wherein its one portion overlaps with the field plate electrode with the insulating film intervened. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008187125(A) 申请公布日期 2008.08.14
申请号 JP20070021337 申请日期 2007.01.31
申请人 TOSHIBA CORP 发明人 SAITO WATARU;ONO SHOTARO
分类号 H01L29/06;H01L29/41;H01L29/78 主分类号 H01L29/06
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