| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure for a semiconductor chip in which excessive crush of bumps can be prevented during ultrasonic bonding without requiring additional time or cost for forming bumps that are made of different materials or have different constitutions. SOLUTION: In the mounting structure for the semiconductor chip 1 which is bonded to a substrate 20 by applying pressure and ultrasonic vibration, spacer bumps 6 and bonding bumps 5 are disposed on a surface of a substrate 20 where the semiconductor chip 1 is bonded, and the spacer bumps 6 are bonded to the substrate 20 by being pressure-welded at a later timing than that of the bonding bumps 5. COPYRIGHT: (C)2008,JPO&INPIT
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