发明名称 Method For Manufacturing Thin Keypad Assembly And Such Assembly
摘要 A method for manufacturing a thin keypad with no seams on a panel surface and such assembly includes the following steps. Inks of different colors are printed onto the surface of a rigid substrate so as to shape panel forms and light-transmitting numerals, letters, symbols, a navigation-key pattern, a dialing pattern and an ending pattern. The panel surface is formed with a plurality of grooves after machining and cutting. Then, inks of different colors are printed onto the surface of a soft substrate so as to form a lining sheet of a light-shielding layer and a reflective layer corresponding to patterns of the panel. The thus-formed panel and lining sheet are disposed into a mold. Rubber is filled in the mold and, after pressing, bound with the bottom of the lining sheet to form a light-guiding layer. At the same time, the light-shielding layer, the reflective layer and the rubber are extruded on the panel surface, so that no seams exist between the keys of the panel surface. Finally, laser is radiated to dot on the light-guiding layer to form thereon light-guiding micro structures having a light-condensing effect.
申请公布号 US2008191904(A1) 申请公布日期 2008.08.14
申请号 US20070673640 申请日期 2007.02.12
申请人 TSAO KAI-JIE 发明人 TSAO KAI-JIE
分类号 H01H13/70 主分类号 H01H13/70
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