发明名称 |
MULTIFUNCTIONAL DIE ATTACHMENT FILM AND SEMICONDUCTOR PACKAGING METHOD USING THE SAME |
摘要 |
A multifunctional die attachment film used in a semiconductor packaging process includes a first die attachment film attached to a surface of a wafer having fine circuit patterns and solder bump patterns and having a first adhesive strength; and a second die attachment film attached on the first die attachment film and having a second adhesive strength with a wafer, a die chip, PCB and a flexible board, and the multifunctional die attachment film serves as a backgrinding tape in a backgrinding process, and after the backgrinding process is completed, the multifunctional die attachment film is not removed, but is used to attach a die chip to a connection member. And, the present invention utilizes the die attachment film as a backgrinding tape in the backgrinding process and concurrently a wafer protection means in a wafer dicing process, thereby preventing sawing burr, scratches or cracks. |
申请公布号 |
WO2008096943(A1) |
申请公布日期 |
2008.08.14 |
申请号 |
WO2007KR03748 |
申请日期 |
2007.08.03 |
申请人 |
LS CABLE LTD.;KANG, BYOUNG-UN;SEO, JOON-MO;SUNG, CHOONG-HYUN;KIM, JAE-HOON;HYUN, SOON-YOUNG |
发明人 |
KANG, BYOUNG-UN;SEO, JOON-MO;SUNG, CHOONG-HYUN;KIM, JAE-HOON;HYUN, SOON-YOUNG |
分类号 |
H01L21/58 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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