发明名称 |
CONDUCTIVE BALL-OR PIN-MOUNTED SEMICONDUCTOR PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND CONDUCTIVE BONDING MATERIAL |
摘要 |
There is disclosed a conductive ball- or pin-mounted semiconductor packaging substrate having a conductive ball or a conductive pin mounted on a conductive land or through-hole of the semiconductor packaging substrate, wherein the conductive ball or the conductive pin is electrically connected with the conductive land or through-hole through a reflow of a conductive bonding material comprising, at least, a low-melting point lead-free SnBi-based solder and a thermosetting adhesive resin exhibiting fluxing effects. |
申请公布号 |
US2008191347(A1) |
申请公布日期 |
2008.08.14 |
申请号 |
US20080020659 |
申请日期 |
2008.01.28 |
申请人 |
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发明人 |
SAWA KAZUNORI;AKAIKE SHINICHI |
分类号 |
H01L23/498;C22C18/00;H01L21/768 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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