PACKAGING FOR LOW COST, HIGH-PERFORMANCE MICROWAVE AND MILLIMETER WAVE MODULES

摘要

Microwave or millimeter wave module packaging having a module with, a baseplate, transition board and cover. The baseplate includes microwave or millimeter wave components attached thereto. The transition board includes a first connector attached to a. first side thereof and operative!)- connected to tiie components, and a second cornice tor attached to a second side thereof and operative!}' connected to the components through the boa.nl The cover and baseplate form a cavity containing the board and components, and the second connector may be- operaliveiy connected Io a third connector such as a printed circuit hoard disposed outside of the cavity and on a higher level assembly. The transition board may further include a fourth connector operauvely connected to the components for providing a signal to an external component or device or receiving a signal from an external component or device.