| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer circuit board used for providing the multilayer circuit board which suppresses the generation of a clearance between the through-hole wall surface of an insulating layer and a via-hole conductor without deteriorating the interface conductivity of a wiring layer and have a high dimensional accuracy. SOLUTION: The manufacturing method for the multilayer circuit board includes a process of superposing burning-shrinkage suppressing sheets 5 for suppressing a burning shrinkage in the direction vertical to the laminating direction of a green-sheet laminate 1 on the upper side and lower side of the green-sheet laminate 1, burning the burning-shrinkage suppressing sheets 5, and removing the burning-shrinkage suppressing sheets 5. The manufacturing method for the multilayer circuit board also has processes of: forming through-holes to a green sheet 1a arranged on at least a surface layer and filling the through-holes with paste 2 for the via-hole conductor; and coating and forming metallic foils 31 at places coating the through-holes of the top face of the green sheet 1a. COPYRIGHT: (C)2008,JPO&INPIT |
