| 摘要 |
<P>PROBLEM TO BE SOLVED: To correctly detect a terminal point for eliminating an initial level difference on a wafer polished surface to improve polishing efficiency, reduce a running cost and improve a yield of the wafer. <P>SOLUTION: An apparatus 11 for detecting the terminal point for eliminating the level difference of a CMP device 10 for polishing a film 20 to be polished formed on a surface of the wafer W includes a light irradiating means 22 for irradiating light to the polished surface during rough polishing of the wafer W, a photoelectric conversion means 23 for converting light intensity of reflected light from the polished surface into an electric signal and outputting it as a light intensity signal, and a determination means 25 for determining the terminal point for eliminating the initial level difference of the wafer W based on the light intensity signal output from the means 23. In addition, the irradiated light is white light. The white light is spectrally divided and input to the photoelectric conversion means 23, and the light intensity signal for each divided wavelength is output. Thus, the terminal point for eliminating the initial level difference is optically detected during the wafer polishing. <P>COPYRIGHT: (C)2008,JPO&INPIT |
