| 摘要 |
PROBLEM TO BE SOLVED: To provide a module device which increases a molding pressure of a sealing resin 13 at the time of trans-molding to steadly seal a resin part 14 of a connector 3, an electronic circuit board 5 on the metal base 1, and a metal base 1. SOLUTION: The module device is made by molding a connector 3, the electronic circuit board 5, and a metal base 1 by a thermosetting sealing resin 13 after preliminarily potting the metal base 1 for mounting the electronic circuit board 5, and a part of a terminal 2 wiring part on the side of the electronic circuit board 5 of the connector 3 screwed to the metal base 1 with a resin 14. A member 12 for restraining a movement of the resin 14 is provided to an inner wall surface of the metal base 1 with the resin 14 potted. COPYRIGHT: (C)2008,JPO&INPIT |
