发明名称 DIFFUSION BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a diffusion bonding method which does not require the use of any conventional separating material, is suitable for mass production, and capable of reducing the cost of the diffusion bonding work. SOLUTION: In the diffusion boding method for heating a material 1 to be bonded in a pressurized state, a separating material 11 consisting of an aluminum-containing alloy is butted to a pressure-receiving surface 1M of the material 1 containing nitrogen, and the pressure-receiving surface 1M is pressed from the separating material 11 in the butted state. Nitrogen gas is generated from the material by the heating. An aluminum nitride is deposited on the surface side butted to the pressure-receiving surface 1M of the separating material 11 by the nitrogen gas and the aluminum in the separating material 11. Since the aluminum nitride is brittle, the material 11 can be separated from the separating material 11 at this part. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008183592(A) 申请公布日期 2008.08.14
申请号 JP20070019853 申请日期 2007.01.30
申请人 NIIGATA UNIV 发明人 OHASHI OSAMU
分类号 B23K20/00;B23K20/26;B23K103/04 主分类号 B23K20/00
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