发明名称 |
OBSERVATION APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE |
摘要 |
A disclosed observation apparatus for observing a void generated in an underfill resin upon mounting a body to be mounted on a substrate via the underfill resin in flip-chip mounting includes: a mounting unit mounting the body to be mounted on the substrate; and an observation unit observing behavior of the underfill resin while the mounting unit is mounting the body to be mounted on the substrate.
|
申请公布号 |
US2008194047(A1) |
申请公布日期 |
2008.08.14 |
申请号 |
US20070877051 |
申请日期 |
2007.10.23 |
申请人 |
FUJITSU LIMITED |
发明人 |
SATO MASAHIKO;IKURA KAZUYUKI;NISHINO TORU |
分类号 |
H01L21/66;H01L21/683 |
主分类号 |
H01L21/66 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|