Method of verifying interconnection reliability and method of manufacturing semiconductor device

摘要

Provided are a method of verifying line reliability and a method of fabricating a semiconductor substrate to improve the line reliability. The semiconductor device fabricating method includes: forming an interlayer insulating layer having a via hole on a semiconductor substrate; forming a seed layer on the interlayer insulating layer; performing an ammonia plasma process on the seed layer to reduce the surface of the seed layer; and forming a copper line using the surface roughness reduced seed layer.