发明名称 Methods of and apparatus for aligning electrodes in a process chamber to protect an exclusion area within an edge environ of a wafer
摘要 Positional relationships are established in a process chamber. A base is configured with a lower electrode surface to support a wafer, and an upper electrode has a lower surface. A drive mounted on the base has a linkage connected to the upper electrode. A fixture placed on the lower surface moves into a desired orientation of the lower electrode. With the upper electrode loosely connected by the linkage to the drive, the fixture transfers the desired orientation to the upper electrode. The linkage is tightened to maintain the desired orientation, the fixture is removed and a process exclusion insert is mounted to the upper electrode. The drive moves the upper electrode and the insert to define an inactive process zone between the upper electrode and the wafer on the lower electrode to protect a central area of the wafer during etching of a wafer edge environ around the central area.
申请公布号 US2008190556(A1) 申请公布日期 2008.08.14
申请号 US20070704870 申请日期 2007.02.08
申请人 LAM RESEARCH CORPORATION 发明人 SEXTON GREGORY S.;BAILEY ANDREW D.;SCHOEPP ALAN M.;BONIFACE JOHN D.
分类号 H01L21/306;B65G47/24;C23C16/00 主分类号 H01L21/306
代理机构 代理人
主权项
地址