| 摘要 |
The present invention relates to microfluidic devices ( 20 ), and in particular, heat management in such devices. To achieve desired thermal properties in selected areas of a microfluidic or nanofluidic device, selective removal or addition of material (thermal mass) can be effected in certain selected regions of the device to control thermal properties, wherein the selected regions are immediately surrounding a reaction chamber ( 14 ) and resulting in an empty space (18). This is particularly useful in accommodating rapid heating and/or cooling rates during sample processing and analysis on a microfluidic or nanofluidic device. |
