| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the performance of a system in-package device. <P>SOLUTION: The system in-package device has: a package substrate 11; an external terminal 12 arranged at one or the other surface side of the package substrate 11; a first chip 13 arranged at the other surface side of the package substrate 11; a second chip 14 arranged on the first one 13; and a plurality of bumps 15 arranged between the first and second chips 13, 14. A signal inputted to the external terminal 12 is inputted to the first ship 13 via the second chip 14. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
