| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an SIP capable of coping with an increase in the number of terminals of a chip. <P>SOLUTION: A system in-package device has: a package substrate 11; an external terminal 12 arranged at one surface side of the package substrate 11; first and second chips 13, 14 arranged side by side at the other surface side of the package substrate 11; a third chip 15 that is arranged over the first and second chips 13, 14 and covers the surface of the first and second chips 13, 14 partially; and a bump 16 arranged between the first and second chips 13, 14, and the third chip 15. The first and second chips 13, 14 exchange a signal via the third chip 15. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
