| 摘要 |
PROBLEM TO BE SOLVED: To provide a peeling method for a tin surface layer, a peeling liquid for a tin surface layer and a peeling system for a tin surface layer by which the tin surface layer provided on the surface of a copper base substrate can simply be peeled off. SOLUTION: The peeling method for the tin surface layer comprises: a stage (A) where a base material in which a tin surface layer containing tin is formed on a substrate containing copper is dipped into a pretreatment liquid; and a stage (B) where, after the stage (A), the base material is dipped into a peeling liquid, and the tin surface layer is peeled. The pretreatment liquid is a strongly basic solution. The peeling liquid is an aqueous solution containing at least either one of sulfuric acid or nitric acid and copper ions. COPYRIGHT: (C)2008,JPO&INPIT
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