| 摘要 |
PROBLEM TO BE SOLVED: To increase sizes of image arrays for purposes of increasing image resolution or field and simultaneously to further reduce the size, complexity, and the number of components in the electrical connection structure. SOLUTION: Circuit structures (10, 20, 30, 40) respectively have a major surface (1a) positioned in a co-planar orientation with respect to a major surface of another of the circuit structures to provide a sequence of the structures (10-40) in a stack-like formation. Electrical connections (34, 47) are formed between adjacent circuit structures in the sequence. A connector region (1b or 1b') on each circuit structure includes a distal portion (1c or 1c') extending away from the major surface (1a), with distal portions (1c, 1c') of connector regions of adjacent structures spaced apart from one another. A first wiring pattern (41, 45, 46) extends from the major surface to the distal portion of the connector region. COPYRIGHT: (C)2008,JPO&INPIT
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