| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection device which has connection terminals capable of contacting an inspection object with high density at a plurality of points, and its manufacturing method. SOLUTION: A hole used as a die for forming the contact terminals 103 is formed by anisotropic etching of a silicon wafer, and using this die, the contact terminals 103, an insulated film 104 made of a polyimide film, and drawing wiring 105 are formed. Furthermore, between the insulated film 104 and a wiring substrate 107, a silicon wafer used as a buffer layer 108 and a substrate 109 is inserted and integrated, and the die is removed. Then, the drawing wiring 105 is connected to an electrode 110a of the wiring substrate 107 by soldering 111. COPYRIGHT: (C)2008,JPO&INPIT
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