发明名称 |
Led Package, Method Of Fabricating The Same, And Backlight Unit Having The Same |
摘要 |
Disclosed are a LED package, a method of fabricating the same, and a backlight unit having the same. The light emitting diode package comprises a light emitting diode, a printed circuit board provided with a circuit pattern used for driving the light emitting diode and a through hole formed in an area where the light emitting diode is mounted, and a heat sink provided in the through hole and contacted with a bottom surface of the light emitting diode.
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申请公布号 |
US2008191231(A1) |
申请公布日期 |
2008.08.14 |
申请号 |
US20060995649 |
申请日期 |
2006.12.28 |
申请人 |
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发明人 |
PARK JUN SEOK;CHOI YONG SEOK |
分类号 |
H01L27/32;H01L33/64;H01L21/329 |
主分类号 |
H01L27/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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