| 摘要 |
A method of dividing a wafer, comprising the steps of forming a deteriorated layer along streets in the inside of the wafer; affixing an adhesive film to the rear surface of the wafer; affixing the adhesive film side of the wafer to a dicing tape mounted on an annular frame; dividing the wafer into individual devices along the streets where the deteriorated layer has been formed by expanding the dicing tape; forming a dividing groove along the outer periphery of each individual device in the adhesive film by applying a laser beam through the spaces between adjacent devices while the dicing tape is expanded by carrying out the first tape expanding step; and dividing the adhesive film along the dividing grooves by further expanding the dicing tape from the state in which the first tape expanding step has been carried out.
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