| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputter method and a sputter device which can perform low-temperature and low-damage film formation with a simple configuration and with a high productivity even if a plurality of substrates are continuously subjected to film formation treatment. SOLUTION: The sputter method and sputter device are characterized in that low-temperature and low-damage film formation is performed in the first film formation part P1 of the first film formation region F1, so as to form an initial layer of film with a prescribed thickness on a substrate B, thereafter, the substrate B is moved to the second film formation part P2 of the second film formation region F2, and subsequently, film formation is performed at a high film formation rate, so as to form a second layer of film, thus a thin film is formed. COPYRIGHT: (C)2008,JPO&INPIT
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