| 摘要 |
According to one embodiment, an electronic apparatus is provided with a semiconductor package, a heat receiving plate, and a gap adjusting member. The semiconductor package includes a substrate and a silicon die mounted on the substrate. The heat receiving plate is opposed to the silicon die and thermally connected to the silicon die. The gap adjusting member is disposed between the heat receiving plate and a region of the substrate apart from the silicon die and serves to reduce a gap which exists between the substrate and the heat receiving plate.
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