发明名称 SEMICONDUCTOR SUBMODULE, METHOD FOR CONNECTING CONNECTOR AND SEMICONDUCTOR SUBMODULE, AND OPTICAL MODULE
摘要 A semiconductor submodule comprises a first substrate (10) having at least one hole and at least one optical semiconductor element (16) arranged such that light passes through the hole, a second substrate (11) having a semiconductor element (26) for driving the semiconductor element (16) and amplifying a signal and an electrical connector (28) for input/output of an electrical signal from/to the outside, and a flexible cable (12) for electrically connecting the end of the substrate (10) with the end of the substrate (11), which cable can be folded to the side opposite to the mounting surface of the optical semiconductor element of the first substrate.
申请公布号 WO2008096716(A1) 申请公布日期 2008.08.14
申请号 WO2008JP51791 申请日期 2008.02.04
申请人 NIPPON TELEGRAPH AND TELEPHONE CORPORATION;TANOBE, HIROMASA;SAKAI, YOSHIHISA;KOBAYASHI, MASARU;NAGASE, RYO 发明人 TANOBE, HIROMASA;SAKAI, YOSHIHISA;KOBAYASHI, MASARU;NAGASE, RYO
分类号 H01S5/022;G02B6/42;H01L31/0232;H01L33/00 主分类号 H01S5/022
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