| 摘要 |
A method and an apparatus for supplying an epoxy molding compound are provided to perform efficiently a molding process using the epoxy molding compound by supplying uniformly the epoxy molding compound in a mold. The stored amount of epoxy molding compound of a powder type is measured(S100). The predetermined amount of epoxy molding compound is supplies to a lower direction at a constant speed(S200). The residual amount of epoxy molding compound is measured after the predetermined amount of epoxy molding compound is supplies to the lower direction(S300). The stored amount of epoxy molding compound is compared with the residual amount of epoxy molding compound to detect a difference between the stored amount of epoxy molding compound and the residual amount of epoxy molding compound(S400). The epoxy molding compound is stored uniformly in a tray by changing a moving speed and a position of the tray(S500).
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