发明名称 SUBSTRATE WASHING DEVICE, SUBSTRATE WASHING METHOD, AND SUBSTRATE WASHING PROGRAM
摘要 PROBLEM TO BE SOLVED: To provide a substrate washing device which enables a good washing of a substrate, a substrate washing method, and a substrate washing program. SOLUTION: The substrate washing device (1) in which a washing of a substrate (wafer 7) is carried out using a cleaning agent (for example, Caro's acid) produced by reacting plural kinds of agents (for example, a sulfuric acid and a hydrogen peroxide solution) comprises a mixing means (31) for mixing plural kinds of agents, a supply means (32) supplying the mixed agents on the surface of the substrate (wafer 7), and a heating means (14) for heating the agents supplied on the surface of the substrate (wafer 7), on the surface of the substrate (wafer 7). In particular, the mixing means (31) has a reaction inhibiting means (33) to inhibit the reaction of the mixed agents, the reaction inhibiting means (33) being a cooling means (30) to cool the mixed agents. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008183550(A) 申请公布日期 2008.08.14
申请号 JP20070022004 申请日期 2007.01.31
申请人 TOKYO ELECTRON LTD 发明人 HIROSHIRO KOKICHI;TOSHIMA TAKAYUKI
分类号 B08B3/10;G02F1/13;G03F7/42;H01L21/304 主分类号 B08B3/10
代理机构 代理人
主权项
地址