发明名称 |
Image sensor package with die receiving opening and method of the same |
摘要 |
The present invention provides a structure of package comprising a substrate with a die through hole and a contact through holes structure formed there through, wherein a terminal pad is formed under the contact through hole structure and a contact pad is formed on a upper surface of the substrate. A die having a micro lens area is disposed within the die through hole by adhesion. A wire bonding is formed on the die and the substrate, wherein the wire bonding is coupled to the die and the contact pad. A protective layer is formed to cover the wire bonding. A transparent cover is disposed on the die within the die through hole by adhesion to expose the micro lens area. Conductive bumps are coupled to the terminal pads.
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申请公布号 |
US2008191333(A1) |
申请公布日期 |
2008.08.14 |
申请号 |
US20070703663 |
申请日期 |
2007.02.08 |
申请人 |
ADVANCED CHIP ENGINEERING TECHNOLOGY INC. |
发明人 |
YANG WEN-KUN;LIN DIANN-FANG;CHANG JUI-HSIEN;WANG TUNG-CHUAN;HSU HSIEN-WEN |
分类号 |
H01L23/02;H01L21/00 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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