A semiconductor device is provided which comprises a substrate (501) having a plurality of bond pads (503) disposed thereon. Each bond pad has a major axis and a minor axis in a direction parallel to the substrate, and the ratio of the major axis to the minor axis increases with the distance of a bond pad from the center of the substrate.
申请公布号
WO2008097714(A1)
申请公布日期
2008.08.14
申请号
WO2008US51780
申请日期
2008.01.23
申请人
FREESCALE SEMICONDUCTOR INC.;PHAM, TIM, V.;UEHLING, TRENT, S.