METHOD FOR PREPARING POLYIMIDE AND POLYIMIDE PREPARED USING THE SAME

摘要

The present invention relates to a method for preparing polyimide having excellent heat resistance and processibility and, more particularly, to a method of preparing polyimide which has desirable mechanical strength during curing at low temperatures and excellent processibility to be used as an insulating film of a metal laminate plate or a coverlay film for print substrates or hard disks, and polyimide prepared using the same.