Multilayer Substrate and Probe Card

摘要

It is an object of the present invention to dramatically reduce thermal deformation without using any special material in a multilayer substrate and a probe card. According to the present invention, in a probe card including at least one circuit board connected in an electrically conductive manner to a probe brought into electrical contact with an inspection object, the circuit board includes a base layer and a surface layer stacked on at least an inspection object side surface of the base layer. The surface layer has a higher coefficient of thermal expansion than that of the base layer, and grooves dividing the surface layer into a plurality of areas are provided in the surface layer.