| 摘要 |
A microelectronics package (100) comprising: a die (112), a lead frame (120) comprising: a substrate (110) having a first side and a second side, an array of contacts (108) positioned on the first side and the second side, and an aperture extending through the substrate between the contacts, wherein at least one contact is electrically coupled to the die, and a mold compound (104) encapsulating the die and the substrate. |
