| 摘要 |
<p>Heat curable silicone compositions comprising (A) an alkenyl-containing organopolysiloxane with 0.5-10 wt% of hydroxyl groups, (B) an organohydrogenpolysiloxane, (C) an addition reaction catalyst, and (D) an epoxy and/or alkoxy group-containing organohydrogenpolysiloxane, epoxy and/or alkoxy group-containing organosilane, or non-siliceous epoxy compound cure into products which have a high hardness, transparency, heat resistance and light resistance, and do not turn white turbid even when held in a hot humid atmosphere.</p> |
