| 摘要 |
<p>A stack package is provided to prevent the defect of a wire bonding by stacking center pad type semiconductor chips using a substrate for a rewire. A lead frame includes a die paddle(100), an inner lead, and an outer lead. A printed circuit board(102) is attached to the die paddle. Electrode terminals are formed at both edges of the printed circuit board. At least two center pad type semiconductor chips(108) are stacked on an upper surface of the printed circuit board. A substrate(112) for a rewire is attached to each semiconductor chip and has a circuit pattern. A side of the circuit pattern is electrically connected to a bonding pad of the semiconductor chip. A first metal wire(114) connects the other side of the circuit pattern of the substrate for a rewire to the electrode terminal of the printed circuit board. A second metal wire(118) electrically connects the inner lead of the lead frame to the electrode terminal of the printed circuit board. A sealing member(122) seals a spatial region including the stacked semiconductor chip, the first and second metal wires, the substrate for a rewire, the dia paddle, and an inner lead of the lead frame.</p> |
