| 摘要 |
A red, green and blue LED(light emitting diode) chips are provided to reduce fabricating cost and investment by eliminating the necessity of a diffusion agent and a diffusion unit. A leadframe is composed of more than one pair of anode leadframes(51,52,53) and cathode leadframes(41,42,43). Die attach parts(21,22,23) attach an LED chip to the inside of the cathode leadframes. A reflection plate(92) is composed of thermoplastic resin and a leadframe reflection cup(C) for inserting a chip to the upper portion of the die attach part. Red, blue and green LED chips(10a,10b,10c) are attached to a die pad reflection cup of the leadframe. The LED chips are conducted by gold wire. Phosphor-including epoxy resin is formed in the thermoplastic resin reflection cup. The red chip can emit light having a wavelength of 615-635 nm. The green chip can emit light having a wavelength of 515-535 nm. The blue chip can emit light having a wavelength of 430-470 nm. The phosphor-including epoxy rein can emit layer having a wavelength of 560-620 nm. |
