发明名称 |
Wafer level packaging cap and fabrication method thereof |
摘要 |
<p>A wafer level packaging cap and method thereof for a wafer level packaging are provided. The wafer level packaging cap covering a device wafer with a device thereon, includes a cap wafer having on a bottom surface a cavity providing a space for receiving the device, and integrally combined with the device wafer, a plurality of metal lines formed on the bottom surface of the cap wafer to correspond to a plurality of device pads formed on the device wafer to be electrically connected to the device, a plurality of buffer portions connected to the plurality of metal lines and comprising a buffer wafer with a plurality of grooves and a metal filled in the plurality of grooves, a plurality of connection rods electrically connected to the plurality of buffer portions and penetrating the cap wafer from a top portion of the buffer portion, and a plurality of cap pads formed on a top surface of the cap wafer and electrically connected to a plurality of connection rods.</p> |
申请公布号 |
EP1688994(B1) |
申请公布日期 |
2008.08.13 |
申请号 |
EP20060000605 |
申请日期 |
2006.01.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, MOON-CHUL;KIM, WOON-BAE;BACK, KAE-DONG;WANG, QIAN;HWANG, JUN-SIK;JUNG, KYU-DONG |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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