| 摘要 |
<p>A semiconductor package is provided to reduce an impedance of a whole semiconductor package by shielding an electromagnetic wave. A semiconductor package includes a printed circuit board, a semiconductor chip(106), a first metal wire(110), a metal plate(108), a second metal wire(112), and an encapsulation agent(116). The printed circuit board has an electrode terminal on a side. The semiconductor chip is arranged on a plane of the printed circuit board. The first metal wire couples a bonding pad of the semiconductor bonding pad to the electrode terminal of the printed circuit board electrically. The metal plate is arranged on an upper part of the semiconductor chip. The second metal wire connects the metal plate to the electrode terminal of the printed circuit board electrically. The encapsulation agent encapsulates a plane of the printed circuit board having the metal plate and the first and second metal wires.</p> |
