ANALYZING APPARATUS, PROCESSING APPARATUS, MEASURING INSTRUMENT, EXPOSURE APPARATUS, SUBSTRATE PROCESSING SYSTEM, ANALYSIS METHOD, AND PROGRAM

摘要

The line width of a pattern on a substrate, which has been exposed and developed by an exposure apparatus, is measured by a measuring instrument. If an analyzing apparatus determines that this line width is abnormal (step 303), the analyzing apparatus identifies an apparatus causing the line width variation according to the matching level between the measured value of the line width and the simulated value thereof (step 307); identifies a factor causing the line width variation according to a statistical value (step 311); and optimizes parameters (steps 315, 317). This improves the yield of a device fabrication process.