发明名称 |
TEMPERATURE CONTROL METHOD, TEMPERATURE CONTROLLER, AND HEAT TREATMENT APPARATUS |
摘要 |
<p>A temperature control method, a temperature controller, and a heat treatment apparatus are provided to adjust a common target time by suppressing a variation in each of processing units. A temperature control method includes a process for controlling temperature of a heating plate to form the measured temperature corresponding to the target temperature by measuring the temperature of the heating plate. A data acquisition process is performed to obtain control data related to a required time necessary for adjusting the temperature of the heating plate from the first temperature as the initial temperature to the second temperature as the target temperature. The substrate is processed on the basis of the obtained control data. The target temperature is controlled after controlling the target temperature.</p> |
申请公布号 |
KR20080074750(A) |
申请公布日期 |
2008.08.13 |
申请号 |
KR20080010931 |
申请日期 |
2008.02.04 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
OOKURA JUN;SEKIMOTO EIICHI;NAKAYAMA HISAKAZU |
分类号 |
H01L21/027;H01L21/324 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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