| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a package of light emitting element which can be connected rigidly with the wiring conductors of an external circuit board while dissipating heat generated from a light emitting element efficiently to the outside and preventing a plurality of external terminal conductor layers from being short-circuited effectively. <P>SOLUTION: In the package of light emitting element, a recess 4 for containing a light emitting element 3 is provided in the upper surface of an insulating substrate 1, a part 2 for mounting the light emitting element 3 and wiring layers 5a and 5b being connected with the electrodes of the light emitting element 3 are formed on the bottom face of the recess 4, and a plurality of external terminal conductor layers 2 electrically connected, respectively, with the wiring layers 5a and 5b are formed on the lower surface of the insulating substrate 1. A trench-like recess 9 having opening ends on the opposite side faces from one side face to the opposite side face of the insulating substrate 1 is formed in the lower surface of the insulating substrate 1 between external terminal conductor layers 8a and 8b. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
