OBSERVATION APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

摘要

An observation apparatus and a method for manufacturing an electronic device are provided to exactly check an occurrence behavior of void by analyzing image data obtained by photographing behavior of underfill material and occurrence of void. An observation apparatus comprises a mounting device(2) and an observation device(3). The mounting device allows an object(4) to be mounted on a substrate(5). The observation device observes behavior of underfill material(12) when the object is mounted on the substrate by the mounting device. The mounting device includes a head(8) for maintaining the object and a stage(10) on which the substrate is mounted. The observation device includes a photographing device for photographing the behavior of the underfill material. A first opening(9) is formed in a photographing position of the object in the head.