| 摘要 |
<p>A semiconductor package is provided to prevent the warpage of the semiconductor package by disposing a porous attaching member between a sealing member and a base substrate. Bonding pads(3) are arranged on a first surface of a base substrate(10). An external connecting terminal(6) connected to the bonding pads is formed on a second surface opposite to the first surface of the base substrate. A semiconductor chip(20) is arranged on the first surface of the base substrate and has plural pads(22). A conductive wire(30) electrically connects the pads to the bonding pads. A porous attaching member(40) is disposed between the first surface of the base substrate and the semiconductor chip and includes plural porosities. A sealing unit(50) is arranged on the porous attaching member. The sealing unit surrounds the semiconductor chip and the conductive wire to protect them. The porous attaching member includes openings(43) for exposing the bonding pads.</p> |
