| 摘要 |
<p>An electronic component mounting method for placing electronic components successively to component placing positions on a board (12) by component holding devices (38a, 39) equipped with a plurality of removable suction nozzles (34) which is operable to hold the electronic components. The method, as an example of its various manners, includes: in placing the electronic components onto a multiple board composed of a plurality of sub-boards, applying a placement step to all the sub-boards, the placement step being a step of placing onto the board all of electronic components that are holdable by an identical suction nozzle; and after completion of the placement step, changing the suction nozzle to another and moving to a next placement step, whereby electronic-component mounting for the individual sub-boards is carried out. In another aspect, component array intervals (M) of component feed sections or intervals (N) of component placing positions on the board are made coincident with array intervals (L) of the component holding devices. <IMAGE></p> |
