PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME

摘要

A printed circuit board and a semiconductor module having the same are provided to reduce a weight and a size of a semiconductor package by disposing a conductive line between adjacent pad groups on an external layer of a printed circuit board. A printed circuit board includes a substrate, a first-group terminal pad(131) and a second-group terminal pad(133), and a first-group conductive member(115a) and a second-group conductive member(115b). The substrate includes first-group via-holes(120a,121a) and second-group via-holes(120b,121b). The first-group pad and the second-group pad are formed on the substrate to surround the first and second-group via-holes. The first and second-group conductive members are formed on the substrate to bury the first and second-group via-holes and are selectively connected to the first and second-group terminal pads.