UNDERFILL ADDED BY METAL OXIDED SUBSTANCE AND PACKAGE-SEMICONDUCTOR AND METHOD OF PACKAGING SEMICONDUCTOR USING IT

摘要

A metal oxide-added underfill, a package-semiconductor using the same, and a method for packaging a semiconductor are provided to effectively reduce stress due to the heterogeneous physical property between a chip and a substrate by using a metal oxide as filler. An underfill is applied between a solder ball(350) and a pad(310) of a semiconductor packaging. A filler to be added to the underfill contains a metal oxide. The metal oxide is rapidly diffused into a solder bump over 200 °C. The metal oxide is a substance which is reduced in the solder bump. The metal oxide is surface-processed by a coupling agent. The metal oxide contains one or more selected from an organic substance, an inorganic substance, and a metal substance. The metal oxide is generated by natural-oxidizing the organic substance, the inorganic substance, and the metal substance, or coating them.