| 摘要 |
A bonding agent is provided to maintain a high flatness of a susceptor for a semiconductor production apparatus, and to show high heat resistance without acting as a pollutant in the production process. A bonding agent(4) puts a susceptor(2) for a semiconductor production apparatus and a cooling plate(3) together. The bonding agent is formed by a cured sheet comprising an addition curable type silicone adhesive. The addition curable type silicone adhesive comprises an organopolysiloxane containing at least two vinyl groups per molecule, an organopolysiloxane resin having a molar ratio of R3SiO1/2 units to SiO4/2 units between 0.6 and 1.6, an organohydrogenpolysiloxane containing a silicon atom-bonding hydrogen atom, a platinum catalyst, and a thermoconductive filler having a content of 20-50vol%. In the R3SiO1/2 unit, R is a C1-6 monovalent hydrocarbon group without an aliphatic unsaturated bond. Further, the thermoconductive filler is formed by one selected from aluminum oxide, aluminum nitride and silicon carbide.
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