SOLDER PASTE COMPOSITION AND SOLDER PRECOATING METHOD

摘要

A solder paste composition and a solder precoating method are provided to form dams on a substrate coated with solder resist films so as to restrict bump defect, to obtain uniform height of the solder bump, and to improve productivity. Dams(4) are formed on a substrate(1) coated with solder resist films(3) having openings to prevent electrodes(2) from being covered. A charged solder paste compound(5) is heated. The solder is attached to surfaces of the electrodes to form solder bumps(6). An internal diameter(L) of the dam is 1 to 3 times longer than a diameter(D) of the exposed electrode.