| 摘要 |
A stacking tray for electrical components, such as integrated circuits, particularly those of the ball grid array (BGA) type. The tray is stackable and includes an upper side and a lower side. Both upper and lower sides of the trays include support elements forming ledges and ridges to support the integrated circuit element and stabilize the integrated circuit element in the X-Y directions. In the unstacked configuration, whether the tray is presented in the right side up or upside down configuration, the integrated circuit elements are stabilized in the X-Y directions at two diagonally opposed corners, and hence all four sides of the chip. In a stacked configuration, the laterally inwardly offset ridges of a tray immediately downwardly adjacent from the integrated circuit restrain and stabilize the integrated circuit in the X-Y directions by engaging a first pair of diagonally opposed corners of the integrated circuit.
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