BIAXIALLY ORIENTED FILM LAMINATED BOARD, ELECTRICAL INSULATION BOARD AND MACHINE PART

摘要

Disclosed is a biaxially oriented film laminated board having a thickness of not less than 0.5 mm, wherein many biaxially oriented films composed of a resin composition having a melting point of not less than 240°C are arranged in layers without having an adhesive therebetween. This biaxially oriented film laminated board is characterized in that the minimum value among the elongation at break in the longitudinal direction and that in the width direction is not less than 25% when a rectangle is punched out of the board. Also disclosed are various electrical insulation board and machine parts each using such a laminated board. The laminated board has the characteristics of a biaxially oriented film, and exhibits adequate heat resistance, electrical insulation, mechanical strength, flexibility and workability.