发明名称 |
Circuit board, device mounting structure, device mounting method, and electronic apparatus |
摘要 |
A circuit board has a metal pattern that is formed on a surface of the circuit board to be connected with bumps in two-dimensional arrangement for mounting an electronic device that has the bumps. A plurality of the bumps which has even electrical potentials is electrically connected by the metal pattern on the surface of the circuit pattern. |
申请公布号 |
US7411295(B2) |
申请公布日期 |
2008.08.12 |
申请号 |
US20040948231 |
申请日期 |
2004.09.24 |
申请人 |
FUJITSU LIMITED |
发明人 |
SUEHIRO MITSUO |
分类号 |
H01L23/12;H01L23/52;H01L21/44;H01L21/60;H01L23/50;H05K1/11;H05K3/34 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|