发明名称 Circuit board, device mounting structure, device mounting method, and electronic apparatus
摘要 A circuit board has a metal pattern that is formed on a surface of the circuit board to be connected with bumps in two-dimensional arrangement for mounting an electronic device that has the bumps. A plurality of the bumps which has even electrical potentials is electrically connected by the metal pattern on the surface of the circuit pattern.
申请公布号 US7411295(B2) 申请公布日期 2008.08.12
申请号 US20040948231 申请日期 2004.09.24
申请人 FUJITSU LIMITED 发明人 SUEHIRO MITSUO
分类号 H01L23/12;H01L23/52;H01L21/44;H01L21/60;H01L23/50;H05K1/11;H05K3/34 主分类号 H01L23/12
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