| 摘要 |
<p>A processing apparatus and a device manufacturing method are provided to perform stably a process by increasing stability thereof. A semiconductor exposure apparatus includes an illumination unit(1) having a light source and a shutter, a reticle(2) having a circuit pattern, and a reticle stage(3). The reticle is loaded on the reticle stage. A reticle position measurement unit(4) measures a position of the reticle on the reticle stage. The semiconductor exposure apparatus further includes a projection lens(5) as a projection optic system, an XY stage(6), and a laser interferometer(7). A wafer(9) is moved on an XY plane of the XY stage. The laser interferometer is used for measuring a position of the XY stage. The semiconductor exposure apparatus further includes an automatic focus unit(10) for measuring a focus position of the wafer.</p> |
